info:eu-repo/semantics/article
Impedance matching of traces and multilayer via transitions for on-package links
Autor
Gaudencio Hernández Sosa
Reydezel Torres Torres
Resumen
A method for achieving impedance matching between traces and multilayer via transitions in on-package chip-to-chip links is presented. The method allows determining of the geometry for minimizing the return loss when a signal propagates through the link. For this purpose, analytical equations are derived using a physically-based equivalent circuit to represent the input impedance of multilayer via transitions. S -parameter measurements performed to optimized links using the method demonstrate the usefulness of the proposal.
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