info:eu-repo/semantics/conferencePaper
Temperature Effects in Automotive-Grade High Speed Interconnects
Registro en:
J. R. Del-Rey, Z. Brito-Brito, J. E. Rayas-Sánchez, and N. Izquierdo, “Temperature effects in automotive-grade high speed interconnects,” in IEEE MTT-S Latin America Microwave Conf. (LAMC-2016), Puerto Vallarta, Mexico, Dec. 2016, pp. 1-4. DOI: 10.1109/LAMC.2016.7851273.
978-1-5090-4288-3
Autor
Del-Rey, Juan R.
Brito-Brito, Zabdiel
Rayas-Sánchez, José E.
Izquierdo, Nicolás
Institución
Resumen
This work discerns the frequency response (up to 15 GHz) of several automotive-grade microstrip transmission line structures over a temperature span from -40 to 105 Celsius degrees. To ensure precise measurements, S-parameter responses from several test PCBs based on Cu over FR4 substrate are attained through a vector network analyzer in a controlled environment. Results show that temperature has a major impact on these high speed interconnects in frequencies above a few GHz, setting the need of employing accurate multi-physical models.