Artículos de revistas
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
Registro en:
Journal Of Electronic Materials. Springer, v. 38, n. 11, n. 2405, n. 2414, 2009.
0361-5235
WOS:000270634800026
10.1007/s11664-009-0888-y
Autor
Garcia, LR
Osorio, WR
Peixoto, LC
Garcia, A
Institución
Resumen
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) A comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength. 38 11 2405 2414 Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) FAEPEX-UNICAMP Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)