Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

dc.creatorGarcia, LR
dc.creatorOsorio, WR
dc.creatorPeixoto, LC
dc.creatorGarcia, A
dc.date2009
dc.dateNOV
dc.date2014-11-18T09:49:43Z
dc.date2015-11-26T16:53:46Z
dc.date2014-11-18T09:49:43Z
dc.date2015-11-26T16:53:46Z
dc.date.accessioned2018-03-28T23:40:57Z
dc.date.available2018-03-28T23:40:57Z
dc.identifierJournal Of Electronic Materials. Springer, v. 38, n. 11, n. 2405, n. 2414, 2009.
dc.identifier0361-5235
dc.identifierWOS:000270634800026
dc.identifier10.1007/s11664-009-0888-y
dc.identifierhttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/72839
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/72839
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/72839
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1276661
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionA comparative experimental study of the main features of the eutectic Sn-Pb alloy and Sn-Zn alloys was carried out with a view to application of the latter alloys as alternative solder materials. The resulting microstructures, mechanical properties (ultimate tensile strength and elongation), and wettability behavior (spreading area and contact angle) of a hypoeutectic Sn-Zn (Sn-4wt.%Zn), a hypereutectic Sn-Zn (Sn-12wt.%Zn), and the eutectic Sn-9wt.%Zn alloy were examined and compared with the corresponding results of the conventional Sn-40wt.%Pb solder alloy. It was found that, of the Sn-Zn alloys examined, the eutectic Sn-9wt.%Zn alloy offers a compromise between lower wettability and higher mechanical strength.
dc.description38
dc.description11
dc.description2405
dc.description2414
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFAEPEX-UNICAMP
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.languageen
dc.publisherSpringer
dc.publisherNew York
dc.publisherEUA
dc.relationJournal Of Electronic Materials
dc.relationJ. Electron. Mater.
dc.rightsfechado
dc.rightshttp://www.springer.com/open+access/authors+rights?SGWID=0-176704-12-683201-0
dc.sourceWeb of Science
dc.subjectSn-Zn solder alloys
dc.subjectwettability
dc.subjecthot-dipping
dc.subjectmechanical properties
dc.subjectcooling rate
dc.subjectsolidification
dc.subjectLead-free Solders
dc.subjectCorrosion-resistance
dc.subjectSolidification Conditions
dc.subjectThermal Parameters
dc.subjectEutectic Alloy
dc.subjectAl-alloys
dc.subjectAg-cu
dc.subjectMicrostructure
dc.subjectTransition
dc.subjectJoints
dc.titleWetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
dc.typeArtículos de revistas


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