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Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Comparative Corrosion behaviour of different Sn-based solder alloys
(Springer, 2014-10-24)
SnPb solders, particularly Sn-37 %Pb eutectic alloy, have been widely used as low temperature joining alloys for some time. However, the restriction of Pb use in industry has been strongly promoted to protect the ...
Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound
(Taylor & Francis Ltd, 2020-07-15)
Sn-Sb solder alloys (2; 5.5 and 10wt-% Sb) were directionally solidified with a view to permitting the effect of a wide range of solidification cooling rates to be related to the resulting microstructure, which is shown ...
Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
(Elsevier Science BvAmsterdamHolanda, 2014)
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
(SpringerNew YorkEUA, 2009)
Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy
(Pergamon-elsevier Science LtdOxfordInglaterra, 2011)
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
(SAGE Publications, 2018-06-22)