Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

article

Fecha

2016-04

Registro en:

SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys. Materials Characterization, [S.L.], v. 114, p. 30-42, abr. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580316300274?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.matchar.2016.02.002

1044-5803

https://repositorio.ufrn.br/handle/123456789/31884

10.1016/j.matchar.2016.02.002

http://repositorioslatinoamericanos.uchile.cl/handle/2250/3943708

Autor

Silva, Bismarck Luiz

Garcia, Amauri

Spinelli, José Eduardo

Institución

Universidade Federal do Rio Grande do Norte (Brasil)

Materias

Sn–Bi–Cu alloys

Sn–Bi–Ag alloys

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