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Immersion Corrosion Of Sn-ag And Sn-bi Alloys As Successors To Sn-pb Alloy With Electronic And Jewelry Applications
(Natl Assoc Corrosion EngHouston, 2016)
Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
(Elsevier, 2017-01-15)
Complex Eutectic Growth And Bi Precipitation In Ternary Sn-bi-cu And Sn-bi-ag Alloys
(Elsevier Science SALausanne, 2017)
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(ELSEVIER SCIENCE INCNEW YORK, 2016)
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(Elsevier Science IncNew York, 2016)
EIS parameters and cell spacings of an Al-Bi alloy in NaCl solution
(Pergamon-elsevier Science LtdOxfordInglaterra, 2013)
Correlações entre parâmetros microestruturais, parâmetros térmicos e resistência mecânica de ligas Sn- Bi e Sn-Bi-(Cu,Ag)
(Universidade Federal de São CarlosUFSCarPrograma de Pós-Graduação em Ciência e Engenharia de Materiais - PPGCEMCâmpus São Carlos, 2016-10-07)
The present research aims to develop a theoretical/experimental analysis of the
combined effects of solidification thermal parameters, Bi content and addition of
ternary elements (Cu, Ag) on the final microstructure ...