Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys

article

Fecha

2017-01-10

Registro en:

Bismarck, L.S.; SILVA, V. C. E.; Garcia, A. ; SPINELLI, J. E.. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017. Disponivel: https://link.springer.com/article/10.1007%2Fs11664-016-5225-7 Acesso em: 26 jan. 2021. https://doi.org/10.1007/s11664-016-5225-7

0361-5235

1543-186X

https://repositorio.ufrn.br/handle/123456789/31836

10.1007/s11664-016-5225-7

http://repositorioslatinoamericanos.uchile.cl/handle/2250/3959619

Autor

Silva, Bismarck Luiz

Silva, Vítor Covre Evangelista da

Garcia, Amauri

Spinelli, José Eduardo

Institución

Universidade Federal do Rio Grande do Norte (Brasil)

Materias

Bi precipitates

Tensile strength

Fracture surface

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