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Assessing the replacement of lead in solders: effects on resource use and human health
(Elsevier B.V., 2014)
The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
(Electrochemical Science GroupBelgradeSérvia, 2012)
Correlation between mechanical properties and dendrite array of the SnZn alloy for lead-free solder
(Univ Fed Rio De Janeiro, Lab HidrogenioRio De Janeiro RjBrasil, 2009)
Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
(Elsevier Science BvAmsterdamHolanda, 2014)
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys
(SpringerNew YorkEUA, 2009)
Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
(Elsevier Science SaLausanneSuíça, 2013)
Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
(Elsevier Science SaLausanneSuíça, 2013)