Artículos de revistas
Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
Registro en:
Journal Of Alloys And Compounds. Elsevier Science Sa, v. 562, n. 194, n. 204, 2013.
0925-8388
WOS:000317268500032
10.1016/j.jallcom.2013.02.050
Autor
Osorio, WR
Leiva, DR
Peixoto, LC
Garcia, LR
Garcia, A
Institución
Resumen
Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) The aim of this experimental investigation is to evaluate the tensile properties of as-cast Sn-Ag alloys as a function of both the resulting secondary dendritic arm spacings and the morphology of the Ag3Sn IMC (intermetallic compound). This comparative experimental investigation was carried out with a view to assess the application of Sn-Ag alloys as alternative solder materials. A directional water-cooled solidification apparatus was used to obtain the as-cast samples. The resulting microstructures, ultimate and yield tensile strengths and elongation of Sn-2 wt.% Ag and Sn-3.5 wt.% Ag alloys were experimentally determined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. It was found that the Sn-Ag alloys examined comply with the compromise between compatible mechanical strength and environmental protection. (C) 2013 Elsevier B. V. All rights reserved. 562 194 204 Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) FAE-PEX/Funcamp (Foundation of the University of Campinas, Unicamp) Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)