conference paper
An efficient bond model for particle adhesion simulation in advanced manufacturing
Autor
Quintana Ruíz, Osvaldo
Campello, Eduardo
Resumen
The aim of the present work is to investigate the underlying structure of most common bond models used in particle dynamics, with an aim to enable their use in additive manufacturing simulation. In this context, in advanced manufacturing processes proper adhesion between particles requires certain stability requirements to be satisfied. Conversely, erroneous agglomeration resulting from particle adhesion may affect the particle-size spatial distribution and thereby compromise the mechanical properties of the manufactured piece. CONACYT – Consejo Nacional de Ciencia y Tecnología