| dc.creator | Cervantes-González, Juan C. | |
| dc.creator | López, Carlos A. | |
| dc.creator | Rayas-Sánchez, José E. | |
| dc.creator | Brito-Brito, Zabdiel | |
| dc.creator | Hernández-Sosa, Gaudencio | |
| dc.date | 2016-01-12T17:32:01Z | |
| dc.date | 2013-08 | |
| dc.date.accessioned | 2023-07-21T21:55:00Z | |
| dc.date.available | 2023-07-21T21:55:00Z | |
| dc.identifier | Cervantes-González, J.C.; López, C.A.; Rayas-Sánchez, J.E.; Brito-Brito, Z, and Hernández-Sosa, G. (2013). “Return-loss minimization of package interconnects through input space mapping using FEM-based models,” in Proc. SBMO/IEEE MTT-S Int. Microwave Optoelectronics Conf. (IMOC-2013), Rio de Janeiro, Brazil, Aug. 2013, pp. 1-4. | |
| dc.identifier | 978-1-4799-1397-8 | |
| dc.identifier | DOI: 10.1109 | |
| dc.identifier | http://hdl.handle.net/11117/2783 | |
| dc.identifier.uri | https://repositorioslatinoamericanos.uchile.cl/handle/2250/7755052 | |
| dc.description | Highly efficient CAD methodologies based on full-wave EM analysis, for the design of package interconnects are necessary due to the increased frequencies of operation and a desire of faster time-to-market. In this work, we exploit a Broyden-based input space mapping (SM) algorithm with both fine and coarse models implemented with the finite-element method (FEM), to efficiently optimize design parameters of a modern package interconnect. This optimization algorithm has been applied to a single-ended package line resulting in a significant decrease of the return loss in the 5-10 GHz range, requiring just a few fine model evaluations. | |
| dc.description | ITESO, A.C. | |
| dc.description | Intel Labs | |
| dc.format | application/pdf | |
| dc.language | eng | |
| dc.publisher | SBMO/IEEE MTT-S International Microwave Optoelectronics Conference (IMOC-2013) | |
| dc.relation | Proceedings of the SBMO/IEEE MTT-S International Microwave Optoelectronics Conference;IMOC-2013 | |
| dc.rights | http://quijote.biblio.iteso.mx/licencias/CC-BY-NC-ND-2.5-MX.pdf | |
| dc.subject | Space Mapping | |
| dc.subject | Package Interconnects | |
| dc.subject | EM-based Design Optimization | |
| dc.subject | High-speed | |
| dc.subject | Return-loss | |
| dc.subject | FEM Space Mapping | |
| dc.title | Return-loss minimization of package interconnects through input space mapping using FEM-based models | |
| dc.type | info:eu-repo/semantics/conferencePaper | |
