Chile
| Ponencia
Tem And Cmi Of Au,Ag,Cu And Agpd Nanoparticles Supported On Hyaluronic Acid
dc.date.accessioned | 2019-03-27T15:57:56Z | |
dc.date.accessioned | 2022-10-18T22:11:26Z | |
dc.date.available | 2019-03-27T15:57:56Z | |
dc.date.available | 2022-10-18T22:11:26Z | |
dc.date.created | 2019-03-27T15:57:56Z | |
dc.date.issued | 2016 | |
dc.identifier | http://hdl.handle.net/10533/234183 | |
dc.identifier | 1140025 | |
dc.identifier.uri | https://repositorioslatinoamericanos.uchile.cl/handle/2250/4465540 | |
dc.description.abstract | Se preparan coloides de Au, Ag, Cu y Ag-Pd en 2-etoxietanol mediante el método de depositación Química de Líquidos a 77 K. Mediante SMAD (Solvated Metal Atom Dispersed). Se soportan las nanopartículas metálicas en Acido Hialurónico [1]. Se determinan los | |
dc.language | eng | |
dc.relation | 4° | |
dc.relation | info:eu-repo/grantAgreement/Fondecyt/1140025 | |
dc.relation | Congreso Nacional de Nanomateriales | |
dc.rights | info:eu-repo/semantics/openAccess | |
dc.title | Tem And Cmi Of Au,Ag,Cu And Agpd Nanoparticles Supported On Hyaluronic Acid | |
dc.type | Ponencia |