| dc.description.abstract | A thermoset polymer can be used for specific applications by creating a unique chemical
composition that is designed for certain characteristic environments. To know the behavior of
a thermoset polymer, it is necessary to thermally analyze its behavior during the curing
process, as well as its mechanical behavior under certain loads that are applied in its field of
application. In this study, the epoxy resin X was created at high temperatures, which there
was no record of its thermal or mechanical behavior; the resin was analyzed to determine if it
was possible to make a reduction in its curing cycle that was at temperature of 425° F with a
time of 24 hours. As a result, through thermal analysis such as Differential Scanning
Calorimetry (DSC), rheometry, Thermogravimetric Analysis (TGA) and Dynamic Mechanical
Thermal Analysis (DMTA); as well as mechanical analysis, such as stress, hardness and
planar cutting tests; it was possible to reduce the curing cycle of resin X, which is used in
aerospace generators, from 24 hours at 425 ° F to 8 hours at 425 ° F. In the same way, this
reduction of the cure cycle was verified by means of a qualification of a product that involved
the reduction of the curing cycle of the epoxy resin obtaining very similar results to the
original ones, verifying that the change of curing in the epoxy resin did not affected the
functioning of the component. This methodology can be used and applied for the study of
thermoset polymers that are used in several industries such as aerospace, automotive, among
others. | |
