Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys

dc.creatorSilva, Bismarck Luiz
dc.creatorSilva, Vítor Covre Evangelista da
dc.creatorGarcia, Amauri
dc.creatorSpinelli, José Eduardo
dc.date.accessioned2021-03-12T15:14:30Z
dc.date.accessioned2022-10-06T12:49:44Z
dc.date.available2021-03-12T15:14:30Z
dc.date.available2022-10-06T12:49:44Z
dc.date.created2021-03-12T15:14:30Z
dc.date.issued2017-01-10
dc.identifierBismarck, L.S.; SILVA, V. C. E.; Garcia, A. ; SPINELLI, J. E.. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, p. 1754-1769, 2017. Disponivel: https://link.springer.com/article/10.1007%2Fs11664-016-5225-7 Acesso em: 26 jan. 2021. https://doi.org/10.1007/s11664-016-5225-7
dc.identifier0361-5235
dc.identifier1543-186X
dc.identifierhttps://repositorio.ufrn.br/handle/123456789/31836
dc.identifier10.1007/s11664-016-5225-7
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3959619
dc.publisherSpringer
dc.rightshttp://creativecommons.org/licenses/by/3.0/br/
dc.rightsAttribution 3.0 Brazil
dc.subjectSn-Bi alloys
dc.subjectSolidification
dc.subjectMicrostructure
dc.subjectBi precipitates
dc.subjectTensile strength
dc.subjectFracture surface
dc.titleEffects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys
dc.typearticle


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