Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

dc.creatorSilva, Bismarck Luiz
dc.creatorGarcia, Amauri
dc.creatorSpinelli, José Eduardo
dc.date.accessioned2021-03-15T20:38:50Z
dc.date.accessioned2022-10-05T22:59:10Z
dc.date.available2021-03-15T20:38:50Z
dc.date.available2022-10-05T22:59:10Z
dc.date.created2021-03-15T20:38:50Z
dc.date.issued2016-04
dc.identifierSILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys. Materials Characterization, [S.L.], v. 114, p. 30-42, abr. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580316300274?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.matchar.2016.02.002
dc.identifier1044-5803
dc.identifierhttps://repositorio.ufrn.br/handle/123456789/31884
dc.identifier10.1016/j.matchar.2016.02.002
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3943708
dc.publisherElsevier
dc.rightshttp://creativecommons.org/licenses/by/3.0/br/
dc.rightsAttribution 3.0 Brazil
dc.subjectSn–Bi–Cu alloys
dc.subjectSn–Bi–Ag alloys
dc.subjectSolder alloys
dc.subjectSolidification
dc.subjectCooling rate
dc.subjectMicrostructure
dc.titleCooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
dc.typearticle


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