dc.creatorGutiérrez, Mario F.
dc.creatorAlegría-Acevedo, Luisa F.
dc.creatorMéndez-Bauer, Luján
dc.creatorBermudez, Jorge
dc.creatorDávila-Sánchez, Andrés
dc.creatorBuvinic, Sonja
dc.creatorHernández-Moya, Nadia
dc.creatorReis, Alessandra
dc.creatorLoguercio, Alessandro D.
dc.creatorFarago, Paulo V.
dc.creatorMartin, Javier
dc.creatorFernández Godoy, Eduardo
dc.date.accessioned2019-10-15T12:25:30Z
dc.date.available2019-10-15T12:25:30Z
dc.date.created2019-10-15T12:25:30Z
dc.date.issued2019
dc.identifierJournal of Dentistry, Volumen 82,
dc.identifier03005712
dc.identifier10.1016/j.jdent.2019.01.012
dc.identifierhttps://repositorio.uchile.cl/handle/2250/171704
dc.description.abstractObjectives: To evaluate the effect of addition of zinc oxide and copper nanoparticles (ZnO/CuNp) into universal adhesives, on antimicrobial activity (AMA), cytotoxicity (CTX), water sorption (WS) and solubility (SO), microhardness (MH) and in vitro degree of conversion (DC), as well as resin-dentin microtensile bond strength (μTBS), nanoleakage (NL) and in situ DC. Methods: ZnO/CuNp (0% [control]; 5/0.1 and 5/0.2 wt%) were added in Prime&Bond Active (PBA) and Ambar Universal (AMB). The AMA was evaluated against Streptococcus mutans. For CTX, Saos-2 cell-line was used. For WS and SO, specimens were tested for 28d. For MH, specimens were tested after 24 h and 28d and for in vitro DC, specimens were evaluated after 24 h. After, the adhesives were applied to flat dentine surfaces, composite resin build-ups, specimens were sectioned to obtain resin–dentine sticks. It was evaluated in μTBS, NL and in situ DC after 24 h of water storage. ANOVA and Tukey's test were applied
dc.languageen
dc.publisherElsevier Ltd
dc.rightshttp://creativecommons.org/licenses/by-nc-nd/3.0/cl/
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Chile
dc.sourceJournal of Dentistry
dc.subjectCopper
dc.subjectMicrotensile bond strength and nanoleakage
dc.subjectNanoparticles
dc.subjectUniversal adhesive system
dc.subjectZinc oxide
dc.titleBiological, mechanical and adhesive properties of universal adhesives containing zinc and copper nanoparticles
dc.typeArtículo de revista


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