dc.contributor | Brito-Brito, Zabdiel | |
dc.contributor | Rayas-Sánchez, José E. | |
dc.creator | DelRey-Acuña, Juan R. | |
dc.date.accessioned | 2018-09-07T17:10:53Z | |
dc.date.available | 2018-09-07T17:10:53Z | |
dc.date.created | 2018-09-07T17:10:53Z | |
dc.date.issued | 2018-07 | |
dc.identifier | DelRey-Acuña, J. R. (2018). Desarrollo de interconexiones rentables de alta velocidad en tarjetas de circuito impreso fabricables en masa para el vehículo conectado. Tesis de doctorado, Doctorado en Ciencias de la Ingeniería. Tlaquepaque, Jalisco: ITESO.Development of Cost-Effective High-Speed Printed Circuit Board Interconnects for Mass Production Towards the Connected Car | |
dc.identifier | http://hdl.handle.net/11117/5572 | |
dc.language | eng | |
dc.publisher | ITESO | |
dc.rights | http://quijote.biblio.iteso.mx/licencias/CC-BY-NC-2.5-MX.pdf | |
dc.subject | Automotive | |
dc.subject | BGA | |
dc.subject | Board to Board | |
dc.subject | Columnoid | |
dc.subject | Coplanar | |
dc.subject | Electromagnetics | |
dc.subject | EMC | |
dc.subject | Environmental Chamber | |
dc.subject | ESD | |
dc.subject | FR4 | |
dc.subject | Impedance Matching | |
dc.subject | Interconnect | |
dc.subject | Internet of Things | |
dc.subject | Mechanical Robustness | |
dc.subject | Microstrip | |
dc.subject | Module in Package | |
dc.subject | Nelco | |
dc.subject | PCB | |
dc.subject | Rogers | |
dc.subject | Solder Spheres | |
dc.subject | Thermal Effects | |
dc.subject | Transmission Lines | |
dc.subject | Waveguide Differential | |
dc.title | Development of Cost-Effective High-Speed Printed Circuit Board Interconnects for Mass Production Towards the Connected Car | |
dc.type | info:eu-repo/semantics/doctoralThesis | |