Artículo de revista
The role of copper nanoparticles in an etch-and-rinse adhesive on antimicrobial activity, mechanical properties and the durability of resindentine interfaces
Fecha
2017-06Registro en:
Journal of Dentistry 61 (2017) 12–20
10.1016/j.jdent.2017.04.007
Autor
Gutiérrez Reyes, Mario
Malaquias, Pamela
Hass, Viviane
Matos, Thalita P.
Lourenco, Lucas
Reis, Alessandra
Loguercio, Alessandro D.
Farago, Paulo Vitor
Institución
Resumen
Objectives: To evaluate the effect of addition of copper nanoparticles at different concentrations into an etchand-rinse
adhesive (ER) on antimicrobial activity, Knoop microhardness (KHN), in vitro and in situ degree of
conversion (DC), as well as the immediate (IM) and 2-year (2Y) resin-dentine bond strength (μTBS) and
nanoleakage (NL).
Methods: Seven experimental ER adhesives were formulated according to the amount of copper nanoparticles
incorporated into the adhesives (0 [control], 0.0075 to 1 wt.%). We tested the antimicrobial activity of adhesives
against Streptococcus mutans using agar diffusion assay after IM and 2Y. The Knoop microhardness and in vitro DC
were tested after IM and 2Y. The adhesives were applied to flat occlusal dentine surfaces after acid etching. After
resin build-ups, specimens were longitudinally sectioned to obtain beam-like resin-dentine specimens (0.8 mm2
),
which were used for evaluation of μTBS and nanoleakage at the IM and 2Y periods. In situ DC was evaluated at
the IM period in these beam-like specimens. Data were submitted to appropriate statistical analyses (α = 0.05).
Results: The addition of copper nanoparticles provided antimicrobial activity to the adhesives only in the IM
evaluation and slightly reduced the KHN, the in vitro and in situ DC (copper concentrations of 1 wt.%). However,
KHN increase for all concentrations after 2Y. After 2Y, no significant reductions of μTBS (0.06 to 1% wt.%) and
increases of nanoleakage were observed for copper containing adhesives compared to the control group.
Conclusion: Copper nanoparticles addition up to 0.5 wt.% may provide antimicrobial properties to ER adhesives
and prevent the