dc.creatorBahamondes, S.
dc.creatorDonoso, S.
dc.creatorHenríquez, R.
dc.creatorFlores Carrasco, Marcos
dc.date.accessioned2014-01-09T18:45:59Z
dc.date.accessioned2019-04-25T23:52:57Z
dc.date.available2014-01-09T18:45:59Z
dc.date.available2019-04-25T23:52:57Z
dc.date.created2014-01-09T18:45:59Z
dc.date.issued2013
dc.identifierThin Solid Films 548 (2013) 646–649
dc.identifierDOI: 10.1016/j.tsf.2013.08.104
dc.identifierhttp://repositorio.uchile.cl/handle/2250/126135
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/2430461
dc.description.abstractWe present a topographical study of the formation of thin films of gold on muscovite mica. The characterization of the samples was done with scanning tunneling microscopy, atomic force microscopy as well as electric measurements.We performed our study on two groups of samples: first group of samples, evaporated at room temperature for thickness ranging from 1.5 up to 97 nm; second group of samples, for two different thicknesses of 3 nmand 50 nmevaporated at different substrate temperatures, between 110 and 530 K. The gold films show a Volmer–Weber growth. The complete films are obtained from samples with a nominal thickness of 8 nm deposited. The average grain diameter is constant, with nominal thicknesses of 18.5 nm, up to 8 nm and increases with the thickness for higher deposition. The average grain diameter is similar regardless of the temperature of the substrate for samples of 3 nm thickness, but changes for samples of 50 nm thickness. The resistivity is inversely dependent on nominal thickness and the mean free path is lineally dependent on nominal thickness.
dc.languageen
dc.publisherElsevier
dc.rightshttp://creativecommons.org/licenses/by-nc-nd/3.0/cl/
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Chile
dc.subjectEvaporation
dc.titleMorphological and electrical study of gold ultrathin films on mica
dc.typeArtículos de revistas


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