Artículos de revistas
Evaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys
Registro en:
Evaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys. Elsevier Science Bv, v. 142, p. 163-167 MAR-2015.
0167-577X
WOS:000349728500045
10.1016/j.matlet.2014.11.088
Autor
Silva
Bismarck Luiz; Cheung
Noe; Garcia
Amauri; Spinelli
Jose Eduardo
Institución
Resumen
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) Wettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, h(i), states the heat ability to flow across the solder/substrate interface during solidification, being affected by the wettability. This letter aims to investigate the wetting behavior of Sn-0.7 wt%Cu-(Ni) lead-free solders by measuring the contact angles (theta) on a copper substrate as a function of the alloy Ni content. Furthermore, time-dependent h(i) profiles are determined from thermal readings during directional solidification (DS) of Sn-0.7 wt%Cu-(xNi) alloys. It is shown that a smaller initial contact angle (theta(i)=32.7) characterizes the Sn-0.7 wt%Cu-0.05 wt%Ni associated with the highest h(i) value of 11,500t(-032.7) w/m(2) K A (t: time). (C) 2014 Elsevier B.V. All rights reserved. 142
163 167 Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) FAPESP [2013/08259-3, 2013/13030-5]