Evaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys

dc.creatorSilva
dc.creatorBismarck Luiz; Cheung
dc.creatorNoe; Garcia
dc.creatorAmauri; Spinelli
dc.creatorJose Eduardo
dc.date2015-MAR
dc.date2016-06-07T13:16:36Z
dc.date2016-06-07T13:16:36Z
dc.date.accessioned2018-03-29T01:37:13Z
dc.date.available2018-03-29T01:37:13Z
dc.identifier
dc.identifierEvaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys. Elsevier Science Bv, v. 142, p. 163-167 MAR-2015.
dc.identifier0167-577X
dc.identifierWOS:000349728500045
dc.identifier10.1016/j.matlet.2014.11.088
dc.identifierhttp://www.sciencedirect.com/science/article/pii/S0167577X1402076X
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/242128
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1305826
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionWettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, h(i), states the heat ability to flow across the solder/substrate interface during solidification, being affected by the wettability. This letter aims to investigate the wetting behavior of Sn-0.7 wt%Cu-(Ni) lead-free solders by measuring the contact angles (theta) on a copper substrate as a function of the alloy Ni content. Furthermore, time-dependent h(i) profiles are determined from thermal readings during directional solidification (DS) of Sn-0.7 wt%Cu-(xNi) alloys. It is shown that a smaller initial contact angle (theta(i)=32.7) characterizes the Sn-0.7 wt%Cu-0.05 wt%Ni associated with the highest h(i) value of 11,500t(-032.7) w/m(2) K A (t: time). (C) 2014 Elsevier B.V. All rights reserved.
dc.description142
dc.description
dc.description
dc.description163
dc.description167
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFAPESP [2013/08259-3, 2013/13030-5]
dc.description
dc.description
dc.description
dc.languageen
dc.publisherELSEVIER SCIENCE BV
dc.publisher
dc.publisherAMSTERDAM
dc.relationMATERIALS LETTERS
dc.rightsembargo
dc.sourceWOS
dc.subjectTransient Directional Solidification
dc.subjectMechanical-properties
dc.subjectCu Substrate
dc.subjectMicrostructure
dc.subjectNi
dc.titleEvaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys
dc.typeArtículos de revistas


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