Artículos de revistas
Effect Of Partially Demineralized Dentin Beneath The Hybrid Layer On Dentin-adhesive Interface Micromechanics
Registro en:
Effect Of Partially Demineralized Dentin Beneath The Hybrid Layer On Dentin-adhesive Interface Micromechanics. Elsevier Sci Ltd, v. 48, p. 701-707 FEB-2015.
0021-9290
WOS:000350527000022
10.1016/j.jbiomech.2014.08.021
Autor
Anchieta
Rodolfo Bruniera; Machado
Lucas Silveira; Sundfeld
Renato Herman; Reis
Andre Figueiredo; Giannini
Marcelo; Luersen
Marco Antonio; Janal
Malvin; Rocha
Eduardo Passos; Coelho
Paulo G.
Institución
Resumen
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Objective: To investigate the presence of non-infiltrated, partially demineralized dentin (PDD) beneath the hybrid layer for self-etch adhesive systems, and its effect on micromechanical behavior of dentin-adhesive interfaces (DAIs). This in-vitro laboratory and computer simulation study hypothesized that the presence of non-infiltrated PDD beneath the hybrid layer does not influence the mechanical behavior of the DAI of self-etch adhesive systems. Methods: Fifteen sound third molars were restored with composite resin using three adhesive systems: Scotchbond Multipurpose (SBMP), Clearfil SE Bond (CSEB) and Adper Promp L-Pop (APLP). The thickness and length of all DAIs were assessed using scanning electron microscopy, and used to generate three-dimensional finite element models. Elastic moduli of the hybrid layer, adhesive layer, intertubular dentin, peritubular dentin and resin tags were acquired using a nano-indenter. Finite element software was used to determine the maximum principal stress. Mixed models analysis of variance was used to verify statistical differences (P < 0.05). Results: Elastic moduli and morphology were found to differ between the adhesive systems, as well as the presence and extension of PDD. Significance: Both self-etch adhesive systems (APLP and CSEB) had PDD. The DAI stress levels were higher for the one-step self-etch adhesive system (APLP) compared with the etch-and-rinse adhesive system (SBMP) and the self-etch primer system (CSEB). (C) 2014 Elsevier Ltd. All rights reserved. 48 4
701 707 Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) FAPESP [2008/002900-9, 2010/12926-7, 2012/07012-1]