Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5M NaCl solution at 25°C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed. © 2013 Elsevier Ltd.80 7181Yu, S.P., Lin, H.J., Hon, M.H., Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate (2000) J. Mater. Sci., 11, pp. 461-471Islam, R.A., Chan, Y.C., Jillek, W., Islam, S., Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders (2006) Microelectron. J., 37, pp. 705-713Çadirli, E., Böyük, U., Engin, S., Kaya, H., Marasli, N., Ülgen, A., Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2wt.% Cu alloy (2009) J. Alloys Compd., 486, pp. 199-206Garcia, L.R., Osório, W.R., Peixoto, L.C., Garcia, A., Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array (2010) Mater. Charact., 61, pp. 212-220Che, F.X., Zhu, W.H., Poh, E.S.W., Zhang, X.W., Zhang, X.R., The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures (2010) J. Alloys Compd., 507, pp. 215-224Wang, M., Wang, J., Feng, H., Ke, W., Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition (2012) Corros. Sci., 63, pp. 20-28Gao, Y.F., Cheng, C.Q., Zhao, J., Wang, L.H., Li, X.G., Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution (2012) Trans. Nonferr. Met. Soc. China, 22, pp. 977-982Garcia, L.R., Peixoto, L.C., Osório, W.R., Garcia, A., Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn 9% Zn solder alloy (2009) Mater. Lett., 63, pp. 1314-1316Montesperelli, G., Rapone, M., Nanni, F., Travaglia, P., Riani, P., Marazza, R., Electrochemical and mechanical behaviour of Sn-25Ag-0.5Cu and Sn-48Bi-2Zn solders (2008) Mater. Corros., 59, pp. 662-669Liu, X., Huang, M., Zhao, Y., Wu, C.M.L., Wang, L., The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering (2010) J. Alloys Compd., 492, pp. 433-438Tsao, L.C., Chen, C.W., Corrosion characterization of Cu-Sn intermetallics in 3.5wt.% NaCl solution (2012) Corros. Sci., 63, pp. 393-398Osório, W.R., Garcia, L.R., Peixoto, L.C., Garcia, A., Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array (2011) Mater. Des., 32, pp. 4763-4772Haseeb, A.S.M.A., Arafat, M.M., Johan, M.R., Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds (2012) Mater. Charact., 64, pp. 27-35Li, D., Conway, P.P., Liu, C., Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution (2008) Corros. Sci., 50, pp. 995-1004Osório, W.R., Spinelli, J.E., Afonso, C.R.M., Peixoto, L.C., Garcia, A., Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn Cu solder alloy (2011) Electrochim. Acta, 56, pp. 8891-8899Osório, W.R., Peixoto, L.C., Garcia, L.R., Garcia, A., Spinelli, J.E., (2012) Int. J. Electrochem. Sci., 7, pp. 6436-6452Gunduz, M., Çardili, E., Directional solidification of aluminium-copper alloys (2002) Mater. Sci. Eng., A327, p. 167Zhao, X., Liu, L., Zhang, W., Yu, Z., Fu, H., Microstructure and orientation variation during cell/dendrite transition in directional solidification of a single crystal nickel-base superalloy (2011) Mater. Chem. Phys., 125, pp. 55-58Hong, S., Chen, W., Zhang, Y., Luo, H.Q., Li, M., Li, N.B., Investigation of the inhibition effect of trithiocyanuric acid on corrosion of copper in 3.0wt.% NaCl (2013) Corros. Sci., 66, pp. 308-314Rosa, D.M., Spinelli, J.E., Ferreira, I.L., Garcia, A., Cellular/dendritic transition and microstructure evolution during transient directional solidification of Pb-Sb alloys (2008) Metall. Mater. Trans. A, 39, pp. 2161-2174Nogita, K., Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys (2010) Intermetallics, 18, p. 145Tewari, N., Raj, S.V., Locci, I.E., A comparison between growth morphology of "eutectic" cells/dendrites and single-phase cells/dendrites (2004) Metall. Mater. Trans., 35 A, p. 1632Silva, B.L., Cheung, N., Garcia, A., Spinelli, J.E., Thermal parameters, microstructure, and mechanical properties of directionally solidified Sn-0.7wt.%Cu solder alloys containing 0ppm to, 1000ppm Ni (2013) J. Electronic. Mater., 42, pp. 179-191Osório, W.R., Freire, C.M., Caram, R., Garcia, A., The role of Cu-based intermetallics on the pitting corrosion behavior of Sn-Cu, Ti-Cu and Al-Cu alloys (2012) Electrochim. Acta, 77, p. 189Garcia, S.J., Markley, T.A., Mol, J.M.C., Hughes, A.E., Unravelling the corrosion inhibition mechanisms of bi-functional inhibitors by EIS and SEM-EDS (2013) Corros. Sci, 69, pp. 346-358Osório, W.R., Peixoto, L.C., Garcia, A., The effects of Ag content and dendrite spacing on the electrochemical behavior of Pb-Ag alloys for Pb-acid battery components (2013) J. Power Sources, 238, pp. 324-335Markhali, B.P., Naderi, R., Mahdavian, M., Sayebani, M., Arman, S.Y., Electrochemical impedance spectroscopy and electrochemical noise measurements as tools to evaluate corrosion inhibition of azole compounds on stainless steel in acidic media (2013) Corros Sci., 75, pp. 269-279Gudic, S., Smoljko, I., Kliskic, M., The effect of small addition of tin and indium on the corrosion behavior of aluminium in chloride solution (2010) J. Alloys Compd., 505, p. 54Zhong, X.K., Zhang, G., Qiu, Y., Chen, Z.Y., Guo, X.P., Fu, C.Y., The corrosion of tin under thin electrolyte layers containing chloride (2013) Corros. Sci., 66, pp. 14-25Mansfeld, F., Kendig, M.W., Evaluation of anodized aluminum surfaces with electrochemical impedance spectroscopy (1998) J. Electrochem. Soc., 135, p. 828Aziz-Kerrzo, M., Conroy, K.G., Fenelon, A.M., Farell, S.T., Breslin, C.B., Electrochemical studies on the stability and corrosion resistance of titanium-based implant materials (2001) Biomaterials, 22, p. 1531Gonzalez, J.E.G., Mirza-Rosca, J.C., Study of the corrosion behavior of titanium and some of its alloys for biomedical and dental implant applications (1999) J. Electroanal. Chem., 471, pp. 109-115Hong, J.H., Lee, S.H., Kim, J.G., Yoon, J.B., Corrosion behaviour of copper containing low alloy steels in sulphuric acid (2012) Corros. Sci., 54, pp. 174-182Yu, D.Q., Wu, C.M.L., Wang, L., The electrochemical corrosion behavior of Sn-9Zn and Sn-8Zn-3Bi lead-free solder alloys in NaCl solution (2005), pp. 19-24. , in: 16th International Corrosion Congress, Beijing, ChinaLi, D.Z., Conway, P., Liu, C.Q., Corrosion characterization of tin-lead and lead in 3.5wt.% NaCl solution (2008) Corros. Sci., 50, pp. 995-1004(1998), pp. 3-1. , MIL-HDBK-5H, Military Handbook, Metallic Materials and Elements for Aerospace Vehicle Structures (Chapter 3)Roberge, P.R., (2008) Corrosion Engineering: Principles and Practice, , McGraw-HillMachida, J., Characterization of coupled-zone in Sn-Cu binary eutectic alloys using unidirectional solidification (2006) J. Jpn. Inst. Metals, 70, p. 7073Rosalbino, F., Angelini, E., Zanicchi, G., Carlini, R., Marazza, R., Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution (2009) Electrochim. Acta, 54, p. 7231Osório, W.R., Freire, C.M.A., Garcia, A., Different immersion periods and aqueous solutions effects upon the corrosion resistance of zinc and aluminium specimens (2005) Revista de Metalurgia v.Extr., p. 160Osório, W.R., Peixoto, L.C., Garcia, A., Electrochemical parameters of equiaxed and columnar grain arrays of a Pb1wt%Sn Alloy for lead-acid battery applications (2011) Int. J. Electrochem. Sci., 6, pp. 1522-1536Osório, W.R., Peixoto, L.C., Goulart, P.R., Garcia, A., Electrochemical corrosion parameters of as-cast Al-Fe alloys in a NaCl solution (2010) Corros. Sci., 52, p. 2979Nogita, K., Gourlay, C.M., McDonald, S.D., Wu, Y.Q., Read, J., Gu, Q.F., Kinetics of the η-η' transformation in Cu6Sn5 (2011) Scripta Mater., 65, pp. 922-925Osório, W.R., Leiva, D.R., Peixoto, L.C., Garcia, L.R., Garcia, A., Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology (2013) J. Alloys Compd., 562, pp. 194-204Osório, W.R., Peixoto, L.C., Garcia, L.R., Mangelinck-Noël, G.A., Microstructure and mechanical properties of Sn-Bi Sn-Ag and Sn-Zn lead-free solder alloys (2013) J. Alloys Compd., 572, pp. 97-106