| dc.creator | Osorio W.R. | |
| dc.creator | Freitas E.S. | |
| dc.creator | Spinelli J.E. | |
| dc.creator | Garcia A. | |
| dc.date | 2014 | |
| dc.date | 2015-06-25T17:56:18Z | |
| dc.date | 2015-11-26T14:43:16Z | |
| dc.date | 2015-06-25T17:56:18Z | |
| dc.date | 2015-11-26T14:43:16Z | |
| dc.date.accessioned | 2018-03-28T21:51:17Z | |
| dc.date.available | 2018-03-28T21:51:17Z | |
| dc.identifier | | |
| dc.identifier | Corrosion Science. , v. 80, n. , p. 71 - 81, 2014. | |
| dc.identifier | 0010938X | |
| dc.identifier | 10.1016/j.corsci.2013.11.010 | |
| dc.identifier | http://www.scopus.com/inward/record.url?eid=2-s2.0-84891628262&partnerID=40&md5=3ff1ea1e8b56d97663cc08c0178a1624 | |
| dc.identifier | http://www.repositorio.unicamp.br/handle/REPOSIP/87001 | |
| dc.identifier | http://repositorio.unicamp.br/jspui/handle/REPOSIP/87001 | |
| dc.identifier | 2-s2.0-84891628262 | |
| dc.identifier.uri | http://repositorioslatinoamericanos.uchile.cl/handle/2250/1251605 | |
| dc.description | Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5M NaCl solution at 25°C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed. © 2013 Elsevier Ltd. | |
| dc.description | 80 | |
| dc.description | | |
| dc.description | 71 | |
| dc.description | 81 | |
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| dc.description | Islam, R.A., Chan, Y.C., Jillek, W., Islam, S., Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders (2006) Microelectron. J., 37, pp. 705-713 | |
| dc.description | Çadirli, E., Böyük, U., Engin, S., Kaya, H., Marasli, N., Ülgen, A., Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2wt.% Cu alloy (2009) J. Alloys Compd., 486, pp. 199-206 | |
| dc.description | Garcia, L.R., Osório, W.R., Peixoto, L.C., Garcia, A., Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array (2010) Mater. Charact., 61, pp. 212-220 | |
| dc.description | Che, F.X., Zhu, W.H., Poh, E.S.W., Zhang, X.W., Zhang, X.R., The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures (2010) J. Alloys Compd., 507, pp. 215-224 | |
| dc.description | Wang, M., Wang, J., Feng, H., Ke, W., Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition (2012) Corros. Sci., 63, pp. 20-28 | |
| dc.description | Gao, Y.F., Cheng, C.Q., Zhao, J., Wang, L.H., Li, X.G., Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution (2012) Trans. Nonferr. Met. Soc. China, 22, pp. 977-982 | |
| dc.description | Garcia, L.R., Peixoto, L.C., Osório, W.R., Garcia, A., Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn 9% Zn solder alloy (2009) Mater. Lett., 63, pp. 1314-1316 | |
| dc.description | Montesperelli, G., Rapone, M., Nanni, F., Travaglia, P., Riani, P., Marazza, R., Electrochemical and mechanical behaviour of Sn-25Ag-0.5Cu and Sn-48Bi-2Zn solders (2008) Mater. Corros., 59, pp. 662-669 | |
| dc.description | Liu, X., Huang, M., Zhao, Y., Wu, C.M.L., Wang, L., The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering (2010) J. Alloys Compd., 492, pp. 433-438 | |
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| dc.description | Osório, W.R., Garcia, L.R., Peixoto, L.C., Garcia, A., Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array (2011) Mater. Des., 32, pp. 4763-4772 | |
| dc.description | Haseeb, A.S.M.A., Arafat, M.M., Johan, M.R., Stability of molybdenum nanoparticles in Sn-3.8Ag-0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds (2012) Mater. Charact., 64, pp. 27-35 | |
| dc.description | Li, D., Conway, P.P., Liu, C., Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution (2008) Corros. Sci., 50, pp. 995-1004 | |
| dc.description | Osório, W.R., Spinelli, J.E., Afonso, C.R.M., Peixoto, L.C., Garcia, A., Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn Cu solder alloy (2011) Electrochim. Acta, 56, pp. 8891-8899 | |
| dc.description | Osório, W.R., Peixoto, L.C., Garcia, L.R., Garcia, A., Spinelli, J.E., (2012) Int. J. Electrochem. Sci., 7, pp. 6436-6452 | |
| dc.description | Gunduz, M., Çardili, E., Directional solidification of aluminium-copper alloys (2002) Mater. Sci. Eng., A327, p. 167 | |
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| dc.description | Hong, S., Chen, W., Zhang, Y., Luo, H.Q., Li, M., Li, N.B., Investigation of the inhibition effect of trithiocyanuric acid on corrosion of copper in 3.0wt.% NaCl (2013) Corros. Sci., 66, pp. 308-314 | |
| dc.description | Rosa, D.M., Spinelli, J.E., Ferreira, I.L., Garcia, A., Cellular/dendritic transition and microstructure evolution during transient directional solidification of Pb-Sb alloys (2008) Metall. Mater. Trans. A, 39, pp. 2161-2174 | |
| dc.description | Nogita, K., Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys (2010) Intermetallics, 18, p. 145 | |
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| dc.description | Silva, B.L., Cheung, N., Garcia, A., Spinelli, J.E., Thermal parameters, microstructure, and mechanical properties of directionally solidified Sn-0.7wt.%Cu solder alloys containing 0ppm to, 1000ppm Ni (2013) J. Electronic. Mater., 42, pp. 179-191 | |
| dc.description | Osório, W.R., Freire, C.M., Caram, R., Garcia, A., The role of Cu-based intermetallics on the pitting corrosion behavior of Sn-Cu, Ti-Cu and Al-Cu alloys (2012) Electrochim. Acta, 77, p. 189 | |
| dc.description | Garcia, S.J., Markley, T.A., Mol, J.M.C., Hughes, A.E., Unravelling the corrosion inhibition mechanisms of bi-functional inhibitors by EIS and SEM-EDS (2013) Corros. Sci, 69, pp. 346-358 | |
| dc.description | Osório, W.R., Peixoto, L.C., Garcia, A., The effects of Ag content and dendrite spacing on the electrochemical behavior of Pb-Ag alloys for Pb-acid battery components (2013) J. Power Sources, 238, pp. 324-335 | |
| dc.description | Markhali, B.P., Naderi, R., Mahdavian, M., Sayebani, M., Arman, S.Y., Electrochemical impedance spectroscopy and electrochemical noise measurements as tools to evaluate corrosion inhibition of azole compounds on stainless steel in acidic media (2013) Corros Sci., 75, pp. 269-279 | |
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| dc.description | Yu, D.Q., Wu, C.M.L., Wang, L., The electrochemical corrosion behavior of Sn-9Zn and Sn-8Zn-3Bi lead-free solder alloys in NaCl solution (2005), pp. 19-24. , in: 16th International Corrosion Congress, Beijing, ChinaLi, D.Z., Conway, P., Liu, C.Q., Corrosion characterization of tin-lead and lead in 3.5wt.% NaCl solution (2008) Corros. Sci., 50, pp. 995-1004 | |
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| dc.description | Osório, W.R., Freire, C.M.A., Garcia, A., Different immersion periods and aqueous solutions effects upon the corrosion resistance of zinc and aluminium specimens (2005) Revista de Metalurgia v.Extr., p. 160 | |
| dc.description | Osório, W.R., Peixoto, L.C., Garcia, A., Electrochemical parameters of equiaxed and columnar grain arrays of a Pb1wt%Sn Alloy for lead-acid battery applications (2011) Int. J. Electrochem. Sci., 6, pp. 1522-1536 | |
| dc.description | Osório, W.R., Peixoto, L.C., Goulart, P.R., Garcia, A., Electrochemical corrosion parameters of as-cast Al-Fe alloys in a NaCl solution (2010) Corros. Sci., 52, p. 2979 | |
| dc.description | Nogita, K., Gourlay, C.M., McDonald, S.D., Wu, Y.Q., Read, J., Gu, Q.F., Kinetics of the η-η' transformation in Cu6Sn5 (2011) Scripta Mater., 65, pp. 922-925 | |
| dc.description | Osório, W.R., Leiva, D.R., Peixoto, L.C., Garcia, L.R., Garcia, A., Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology (2013) J. Alloys Compd., 562, pp. 194-204 | |
| dc.description | Osório, W.R., Peixoto, L.C., Garcia, L.R., Mangelinck-Noël, G.A., Microstructure and mechanical properties of Sn-Bi Sn-Ag and Sn-Zn lead-free solder alloys (2013) J. Alloys Compd., 572, pp. 97-106 | |
| dc.language | en | |
| dc.publisher | | |
| dc.relation | Corrosion Science | |
| dc.rights | fechado | |
| dc.source | Scopus | |
| dc.title | Electrochemical Behavior Of A Lead-free Sn-cu Solder Alloy In Nacl Solution | |
| dc.type | Artículos de revistas | |
