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Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
(Elsevier, 2017-01-15)
Correlações entre parâmetros microestruturais, parâmetros térmicos e resistência mecânica de ligas Sn- Bi e Sn-Bi-(Cu,Ag)
(Universidade Federal de São CarlosUFSCarPrograma de Pós-Graduação em Ciência e Engenharia de Materiais - PPGCEMCâmpus São Carlos, 2016-10-07)
The present research aims to develop a theoretical/experimental analysis of the
combined effects of solidification thermal parameters, Bi content and addition of
ternary elements (Cu, Ag) on the final microstructure ...
Complex Eutectic Growth And Bi Precipitation In Ternary Sn-bi-cu And Sn-bi-ag Alloys
(Elsevier Science SALausanne, 2017)
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(ELSEVIER SCIENCE INCNEW YORK, 2016)
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(Elsevier Science IncNew York, 2016)
Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
(Elsevier Science SaLausanneSuíça, 2013)
Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications
(Elsevier Sci LtdOxfordInglaterra, 2014)