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Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(ELSEVIER SCIENCE INCNEW YORK, 2016)
Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
(Elsevier Science IncNew York, 2016)
Comparative Corrosion behaviour of different Sn-based solder alloys
(Springer, 2014-10-24)
SnPb solders, particularly Sn-37 %Pb eutectic alloy, have been widely used as low temperature joining alloys for some time. However, the restriction of Pb use in industry has been strongly promoted to protect the ...
Fluidity of Sn-based eutectic solder alloys
(Springer, 2015-12)
Eutectic alloys have a great importance in both academic and technological point of view. As regard technological applications such as casting, welding andjoining, these systems offer lower melting point than the pure ...
Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array
(Elsevier Science IncNew YorkEUA, 2010)