Artículos de revistas
Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array
Registro en:
Materials Characterization. Elsevier Science Inc, v. 61, n. 2, n. 212, n. 220, 2010.
1044-5803
WOS:000275310500011
10.1016/j.matchar.2009.11.012
Autor
Garcia, LR
Osorio, WR
Peixoto, LC
Garcia, A
Institución
Resumen
Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) The aim of this study is to develop a comparative experimental study interrelating mechanical properties, solidification thermal parameters and microstructure characteristics of a hypoeutectic Sn-4 wt.% Zn, a hypereutectic Sn-12 wt.% Zn and a eutectic Sn-9 wt.% Zn solder alloys. A water-cooled vertical upward unidirectional solidification system was used to obtain the samples. It was found that a more homogeneous distribution of the eutectic mixture, which occurs for smaller dendritic spacings in hypoeutectic and hypereutectic alloys, increases the ultimate tensile strength. The resulting microstructure of the eutectic Sn-9 wt.% Zn alloy has induced higher mechanical strength than those of the Sn-4 wt.% Zn and Sn-12 wt.% Zn alloys. It was found that the eutectic alloy experiences a microstructural transition from globular-to-needle-like Zn-rich morphologies which depend on the solidification growth rate. It is also shown that a globular-like Zn-rich morphology provides higher ultimate tensile strength than a needle-like Zn-rich eutectic morphology. (C) 2009 Elsevier Inc. All rights reserved 61 2 212 220 Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) FAEPEX-UNICAMP Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)