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Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
(Elsevier, 2017-01-15)
Complex Eutectic Growth And Bi Precipitation In Ternary Sn-bi-cu And Sn-bi-ag Alloys
(Elsevier Science SALausanne, 2017)
Transient directional solidification of a eutectic Al–Si–Ni alloy: Macrostructure, microstructure, dendritic growth and hardness
(2019-09-01)
The Al-11 wt%Si-5 wt%Ni eutectic alloy was directionally solidified (DS) under transient heat flow conditions at cooling rates in a range of about 1–25 °C/s along the length of the casting. For comparison purposes binary ...
Influence of aging on microstructure and hardness of lead-free solder alloys
(Emerald, 2021-01-08)
Purpose: The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures ...
Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
(SAGE Publications, 2018-06-22)
Microstructure of the microalloyed NiAl-V eutectics
(Elsevier Science BvAmsterdamHolanda, 2002)
Mechanical properties of Sn-Zn lead-free solder alloys based on the microstructure array
(Elsevier Science IncNew YorkEUA, 2010)
Near-eutectic Zn-Mg alloys: Interrelations of solidification thermal parameters, microstructure length scale and tensile/corrosion properties
(2019-05-01)
Zn-Mg alloys are considered to have potential application in bone implants, since both metals are biocompatible and have biodegradable characteristics. Adding Mg to Zn can boost mechanical and corrosion resistances. However, ...
Microstructure development during directional solidification of Sn–Ag–Cu ternary alloys
(Maney Publishing, 2018-03)
Replace of Pb–Sn with Pb-free solders (LFS) is one of the most important issues in the electronic industry. Eutectic and near-eutectic Sn–Ag–Cu (SAC) alloys are recommended as lead-free replacement in welding processes of ...