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Effect of Sn and Cu on corrosion resistance of LaMgAlMnCoNi type alloys

CASINI, JULIO C.S.; SAEKI, MARGARIDA J.; GUO, ZAIPING; LIU, HUA K.; FARIA, RUBENS N. de; TAKIISHI, HIDETOSHI; INTERNATIONAL LATIN-AMERICAN CONFERENCE ON POWDER THECHNOLOGY, 10th (2016)

Microstructural development in Al-Sn alloys directionally solidified under transient heat flow conditions

Cruz, KS; Spinelli, JE; Ferreira, LL; Cheung, N; Garcia, A (Elsevier Science SaLausanneSuíça, 2008)

Influ??ncia do estanho na absor????o de hidrog??nio em ligas ?? base de LaMgAlMnCoNiSn

FIM, RAFAEL G.T.; TAKIISHI, HIDETOSHI; PROGRAMA INSTITUCIONAL DE BOLSAS DE INICIA????O CIENT??FICA, 20.; PROGRAMA DE BOLSAS E INICIA????O CIENT??FICA CNEN, 11.; PROGRAMA INSTITUCIONAL DE BOLSAS DE INICIA????O DESENVOLVIMENTO TECNOL??GICO E INOVA????O, 4. (2016)

Microstructure and electrochemical performance of LaMgAlMnCoSnNi alloys alloys for nickel ??? metal hydride batteries

CASINI, J.C.S.; GITTI, R.T.; ROHRIG, M.; CAVALHEIRA, E.D.; FARIA, R.N.; TAKIISHI, H.; CONGRESSO BRASILEIRO DE ENGENHARIA E CI??NCIA DOS MATERIAIS, 21. (2015)

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Garcia, LR; Osorio, WR; Peixoto, LC; Garcia, A (SpringerNew YorkEUA, 2009)

Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy

Santos, WLR; Brito, C; Quaresma, JMV; Spinelli, JE; Garcia, A (Elsevier Science BvAmsterdamHolanda, 2014)

Analysis of current dendritic growth models during downward transient directional solidification of Sn-Pb alloys

Spinelli, JE; Garcia, A (Elsevier Science BvAmsterdamHolanda, 2005)

Effect of Sn and Cu on corrosion resistance of LaMgAlMnCoNi type alloys

CASINI, JULIO C.S.; SAEKI, MARGARIDA J.; GUO, ZAIPING; LIU, HUA K.; FARIA, RUBENS N. de; TAKIISHI, HIDETOSHI (2017)

Electrochemical corrosion of Pb-1 wt% Sn and Pb-2.5 wt% Sn alloys for lead-acid battery applications

Osorio, WR; Peixoto, LC; Garcia, A (Elsevier Science BvAmsterdamHolanda, 2009)

Thermosolutal convective effects on dendritic array spacings in downward transient directional solidification of Al-Si alloys

Spinelli, JE; Peres, MD; Garcia, A (Elsevier Science SaLausanneSuíça, 2005)

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Filtros

Effect of Sn and Cu on corrosion resistance of LaMgAlMnCoNi type alloys

Microstructural development in Al-Sn alloys directionally solidified under transient heat flow conditions

Influ??ncia do estanho na absor????o de hidrog??nio em ligas ?? base de LaMgAlMnCoNiSn

Microstructure and electrochemical performance of LaMgAlMnCoSnNi alloys alloys for nickel ??? metal hydride batteries

Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys

Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy

Analysis of current dendritic growth models during downward transient directional solidification of Sn-Pb alloys

Effect of Sn and Cu on corrosion resistance of LaMgAlMnCoNi type alloys

Electrochemical corrosion of Pb-1 wt% Sn and Pb-2.5 wt% Sn alloys for lead-acid battery applications

Thermosolutal convective effects on dendritic array spacings in downward transient directional solidification of Al-Si alloys