Buscar
Mostrando ítems 11-20 de 533
Optimal conditions for the wetting balance test
(ELSEVIER SCIENCE SA, 2009)
Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different ...
Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy
(Pergamon-elsevier Science LtdOxfordInglaterra, 2011)
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples
(2019-01-01)
Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder ...
Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration
(Universidade do Vale do Rio dos Sinos, 2018-01-16)
Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration
(Universidade do Vale do Rio dos Sinos, 2018-01-16)
Interrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys
(TAYLOR & FRANCIS LTDABINGDON, 2016)
Interrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys
(Taylor & Francis LtdAbingdon, 2016)
SISCONTROL: sistema de controle digital de temperatura para forno de solda BGA e SMD
(Universidade Tecnológica Federal do ParanáCuritibaDepartamento Acadêmico de Eletrônica, 2013-05-03)
This document discusses the development of a project of digital temperature control o fan oven to be used as a tool for soldering electronic circuits. The physical interface of the project consists of three modules: digital, ...