dc.contributorUniversidade Estadual Paulista (UNESP)
dc.creatorDias Filho, Newton Luiz
dc.creatorDe Aquino, Hermes Adolfo
dc.creatorPires, Geovanna
dc.creatorCaetano, Laércio
dc.date2014-05-27T11:21:53Z
dc.date2016-10-25T18:22:16Z
dc.date2014-05-27T11:21:53Z
dc.date2016-10-25T18:22:16Z
dc.date2006-06-08
dc.date.accessioned2017-04-06T01:19:02Z
dc.date.available2017-04-06T01:19:02Z
dc.identifierJournal of the Brazilian Chemical Society, v. 17, n. 3, p. 533-541, 2006.
dc.identifier0103-5053
dc.identifierhttp://hdl.handle.net/11449/68921
dc.identifierhttp://acervodigital.unesp.br/handle/11449/68921
dc.identifier10.1590/S0103-50532006000300016
dc.identifierS0103-50532006000300016
dc.identifierWOS:000237738400016
dc.identifier2-s2.0-33744778706.pdf
dc.identifier2-s2.0-33744778706
dc.identifierhttp://dx.doi.org/10.1590/S0103-50532006000300016
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/890228
dc.descriptionThe relationship between the dielectric properties (dielectric constant, ε′, and loss factor, ε; activation energy, E a) and the ratio of epoxy resin (OG) to hardener of the epoxy resin thermosetting polymers was investigated. The amplitude of the ε″ peak decreases with increasing OG content until about 73 wt.% and slightly increases at higher OG content. The temperature of the position of the ε″ peak increases with the increasing of OG content, reaching maximum values for compositions in the range of 67 and 73 wt.%, and then it decreases sharply at higher OG content. The activation energy obtained from dielectric relaxation increased with increasing wt.% OG up to around 70 wt.%. Further increase in concentration of OG up to 83 wt.% reduced E a. The curves of tensile modulus and fracture toughness mechanical properties as a function of OG content presented a similar behavior. ©2006 Sociedade Brasileira de Química.
dc.languageeng
dc.relationJournal of the Brazilian Chemical Society
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectDielectric analysis
dc.subjectDieletric relaxation
dc.subjectEpoxy resin
dc.subjectThermosetting materials
dc.titleRelationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers
dc.typeOtro


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