Analysis of the Phase Transition during High Speed Scratching of Silicon

dc.contributorSüssmaier, Stefan
dc.contributorXavier, Fábio Antonio
dc.contributorUniversidade Federal de Santa Catarina.
dc.creatorDias, Ariely Miranda
dc.date2023-05-25T12:29:17Z
dc.date2023-05-25T12:29:17Z
dc.date2021-12-16
dc.date.accessioned2023-09-02T12:50:19Z
dc.date.available2023-09-02T12:50:19Z
dc.identifierhttps://repositorio.ufsc.br/handle/123456789/246082
dc.identifier.urihttps://repositorioslatinoamericanos.uchile.cl/handle/2250/8598570
dc.descriptionTCC (graduação) - Universidade Federal de Santa Catarina, Centro Tecnológico, Engenharia de Materiais.
dc.descriptionWhen cutting brittle materials at small scales, machining in ductile regime can be obtained. Increasing the depth of cut to a critical value leads to a ductile to brittle transition in the removal process. The ductile machining is associated with phase transitions. This study investigated the change in the phase transitions when machining monocrystalline silicon with a diamond indenter. The experimental setup kinematic was that of a face turning process with no overlapping trace, with Vickers and Berkovich indenters in different orientations. The analysis of phases was performed in Raman microspectroscopy. The scratches provided evidence that even the material removal mechanism being different for the different indenters and orientations, this change does not have a significant influence on the Raman intensity ratio of amorphous phase against crystalline phase. For the diamond wire sawing process, this means that the grain shape of diamonds in the wire will not influence the surface residual phases.
dc.formatapplication/pdf
dc.languageen
dc.publisherZurich, Suíça
dc.rightsOpen Access.
dc.subjectsilício
dc.subjecttransição de fase
dc.subjectscratch test
dc.titleAnálise da transição de fase de silício em “scratch tests” de alta velocidade
dc.titleAnalysis of the Phase Transition during High Speed Scratching of Silicon
dc.typeTCCgrad


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