| dc.creator | CLAUDIA REYES BETANZO | |
| dc.date | 2013-04-15 | |
| dc.date.accessioned | 2023-07-25T16:25:26Z | |
| dc.date.available | 2023-07-25T16:25:26Z | |
| dc.identifier | http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/2354 | |
| dc.identifier.uri | https://repositorioslatinoamericanos.uchile.cl/handle/2250/7807530 | |
| dc.description | A piecewise linear algorithm for predicting silicon etch rates in fluorine-based plasmas is shown. Discrete experimental data of pressure and RF power in reactive ion etching are used to construct a set of local two-dimensional etching functions that serve as a basis for computing numerical solutions (pressure and power values for a specific predicted silicon etch rate). It must be pointed out that, although the algorithm scans the entire data domain, a testing procedure is applied to ensure that the computing task will be invoked only when a solution exists, and otherwise it will be discarded (this avoids brute force methods). In the last step of the algorithm, all solutions are collected and interpolated to construct a solution path. In order to verify the match between the experimental etching results and numerical predictions, the algorithm has been coded and tested using Maple® Release 13.0, showing a successful validation with a difference between experimental data and computed numerical solutions as low as 1% for SF₆, and 4% for SF₆/O₂ in the best case and a root-mean squared error of 0.03. | |
| dc.format | application/pdf | |
| dc.language | eng | |
| dc.publisher | Journal of the Chinese Institute of Engineers | |
| dc.relation | citation:Jimenez-Fernandez, V.M., et al., (2013), Prediction of silicon dry etching using a piecewise linear algorithm, Journal of the Chinese Institute of Engineers, Vol. 36(7): 941–950 | |
| dc.rights | info:eu-repo/semantics/openAccess | |
| dc.rights | http://creativecommons.org/licenses/by-nc-nd/4.0 | |
| dc.subject | info:eu-repo/classification/Inspec/Silicon etching | |
| dc.subject | info:eu-repo/classification/Inspec/Piecewise linear | |
| dc.subject | info:eu-repo/classification/Inspec/Algorithm | |
| dc.subject | info:eu-repo/classification/cti/1 | |
| dc.subject | info:eu-repo/classification/cti/22 | |
| dc.subject | info:eu-repo/classification/cti/2203 | |
| dc.subject | info:eu-repo/classification/cti/2203 | |
| dc.title | Prediction of silicon dry etching using a piecewise linear algorithm | |
| dc.type | info:eu-repo/semantics/article | |
| dc.type | info:eu-repo/semantics/acceptedVersion | |
| dc.audience | students | |
| dc.audience | researchers | |
| dc.audience | generalPublic | |
