dc.creatorMIGUEL ANGEL TLAXCALTECO MATUS
dc.creatorReydezel Torres Torres
dc.date2010
dc.date.accessioned2023-07-25T16:23:51Z
dc.date.available2023-07-25T16:23:51Z
dc.identifierhttp://inaoe.repositorioinstitucional.mx/jspui/handle/1009/1535
dc.identifier.urihttps://repositorioslatinoamericanos.uchile.cl/handle/2250/7806730
dc.descriptionA model and parameter extraction method for a via-to-SIW transition is presented. The model is derived from an analysis of experimental data and full-wave simulations, allowing to obtain the equivalent circuit parameters for the via including its interaction with the SIW. It is demonstrated through a careful model-experiment correlation that the application of this method allows the correct representation of the via-to-SIW transitions implemented on printed circuit board technology even when changing the structure of the SIW environment.
dc.formatapplication/pdf
dc.languageeng
dc.publisherIEEE
dc.relationcitation:Tlaxcalteco-Matus, M.A. & Torres-Torres, R. (2010). Systematic modeling and characterization of a via-to-SIW transition, IEEE Microwave and Wireless Components Letters, Vol. 20, (12): 657-659
dc.rightsinfo:eu-repo/semantics/openAccess
dc.rightshttp://creativecommons.org/licenses/by-nc-nd/4.0
dc.subjectinfo:eu-repo/classification/Interconnection/Interconnection
dc.subjectinfo:eu-repo/classification/Printed Circuit Board (PCB)/Printed Circuit Board (PCB)
dc.subjectinfo:eu-repo/classification/Substrate Integrated Waveguide (SIW)/Substrate Integrated Waveguide (SIW)
dc.subjectinfo:eu-repo/classification/Transition/Transition
dc.subjectinfo:eu-repo/classification/Via/Via
dc.subjectinfo:eu-repo/classification/cti/1
dc.subjectinfo:eu-repo/classification/cti/22
dc.subjectinfo:eu-repo/classification/cti/2203
dc.subjectinfo:eu-repo/classification/cti/2203
dc.titleSystematic modeling and characterization of a via-to-SIW transition
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/acceptedVersion
dc.audiencestudents
dc.audienceresearchers
dc.audiencegeneralPublic


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