dc.contributor | REYDEZEL TORRES TORRES | |
dc.creator | MIGUEL ANGEL TLAXCALTECO MATUS | |
dc.date | 2015-02 | |
dc.date.accessioned | 2023-07-25T16:20:56Z | |
dc.date.available | 2023-07-25T16:20:56Z | |
dc.identifier | http://inaoe.repositorioinstitucional.mx/jspui/handle/1009/129 | |
dc.identifier.uri | https://repositorioslatinoamericanos.uchile.cl/handle/2250/7805350 | |
dc.description | Nowadays, computational systems are demanding high performance operating
frequencies with a high-density interconnect (HDI) scheme. As a result the impact of the
common-mode noise present in these systems in the signal integrity has become a major
concern. Differential interconnects have demonstrated to be a reliable solution due to its
property of being less susceptible to this type of noise. Nevertheless, these interconnects
consists of two signal traces to carry the data with an electromagnetic coupling between
them. For this reason, studying the coupling between the signal traces is mandatory these
days for optimizing the corresponding interconnects. Moreover, it is of great interest to
study the coupling mechanisms between these two signal traces and how it can be modeled
with lumped circuits. In this regard, the purpose of this thesis is to propose new
methodologies to implement equivalent circuit models in commercial circuit simulators,
with their corresponding parameters extraction processes for this interconnects.
Consequently, a new topology for the characterization of a differential launch structure and
the implementation of a model for the homogeneous part of a differential transmission line
which considers the effect of the current distribution in the inductance of the line are
presented as a result of this thesis.
Chip design as well as fabrication technologies have experienced a tremendous
evolution in recent years allowing the transmission of data at very high data rates within the
tens of Gbps. Thus, the losses associated to a transmission line are reaching unacceptable
levels letting current high-speed electronic systems unable to handle higher frequencies
signals, becoming these interconnects the bottleneck when designing high-speed
interconnection channels. For this reason, electronic systems performance at high
frequencies has to improve by identifying the effects that negatively influence the
corresponding electrical performance. In order to this, equivalent circuit models for
differential transmission lines used in complex devices such as HDI PCBs or packages can
be used in the analysis to carry out an optimization of the interconnection channel. | |
dc.format | application/pdf | |
dc.language | eng | |
dc.publisher | Instituto, Nacional de Astrofísica, Óptica y Electrónica | |
dc.relation | citation:Tlaxcalteco-Matus M.A. | |
dc.rights | info:eu-repo/semantics/openAccess | |
dc.rights | http://creativecommons.org/about/cc0/ | |
dc.subject | info:eu-repo/classification/Líneas de transmisión/Transmission lines | |
dc.subject | info:eu-repo/classification/Medida de microondas/Microware mesurement | |
dc.subject | info:eu-repo/classification/Transmisión de ondas electromagnéticas/Electromagnetic wave transmission | |
dc.subject | info:eu-repo/classification/cti/1 | |
dc.subject | info:eu-repo/classification/cti/22 | |
dc.subject | info:eu-repo/classification/cti/2203 | |
dc.subject | info:eu-repo/classification/cti/2203 | |
dc.title | Modeling and characterizing interconnects for high-speed signaling using equivalent circuit representations | |
dc.type | info:eu-repo/semantics/doctoralThesis | |
dc.audience | generalPublic | |