dc.date.accessioned2019-01-29T22:19:56Z
dc.date.accessioned2023-05-30T23:27:50Z
dc.date.available2019-01-29T22:19:56Z
dc.date.available2023-05-30T23:27:50Z
dc.date.created2019-01-29T22:19:56Z
dc.date.issued2010
dc.identifier8952477
dc.identifierhttp://repositorio.ucsp.edu.pe/handle/UCSP/15899
dc.identifierhttps://doi.org/10.1002/mop.25276
dc.identifier.urihttps://repositorioslatinoamericanos.uchile.cl/handle/2250/6477711
dc.description.abstractThis letter presents an analysis of microstrip lines that are printed on substrates composed of numerous dielectric layers using a fast technique that comprises the full-wave equivalent circuit and the discrete mode matching method. The validation of the proposed formulation has been done with a commercial package based on the finite-element method and very good agreement has been obtained. As a special application of our technique, we consider the analysis of microstrip lines printed on substrates with dielectric constants that vary according to given graded-index profiles. The profiles are modelled by replacing the substrate by numerous homogeneous dielectric layers. © 2010 Wiley Periodicals, Inc.
dc.languageeng
dc.publisherJohn Wiley and Sons Inc.
dc.relationhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-77952168897&doi=10.1002%2fmop.25276&partnerID=40&md5=db15449be99b8097909f6ac1b007c047
dc.rightsinfo:eu-repo/semantics/restrictedAccess
dc.sourceRepositorio Institucional - UCSP
dc.sourceUniversidad Católica San Pablo
dc.sourceScopus
dc.subjectEquivalent circuits
dc.subjectMicrostrip lines
dc.subjectSubstrates
dc.subjectCommercial packages
dc.subjectConformal structures
dc.subjectCylindrical microstrip lines
dc.subjectDielectric layer
dc.subjectDiscrete mode matching
dc.subjectFast techniques
dc.subjectHomogeneous dielectrics
dc.subjectSpecial applications
dc.subjectFinite element method
dc.titleFast analysis of cylindrical microstrip lines printed on substrates composed of multiple layers
dc.typeinfo:eu-repo/semantics/article


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