dc.contributorUniversidade de São Paulo (USP)
dc.contributorUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2019-10-04T19:12:43Z
dc.date.accessioned2022-12-19T18:17:36Z
dc.date.available2019-10-04T19:12:43Z
dc.date.available2022-12-19T18:17:36Z
dc.date.created2019-10-04T19:12:43Z
dc.date.issued2017-01-01
dc.identifier2017 Ieee Soi-3d-subthreshold Microelectronics Technology Unified Conference (s3s). New York: Ieee, 3 p., 2017.
dc.identifier2573-5926
dc.identifierhttp://hdl.handle.net/11449/186358
dc.identifierWOS:000463041500089
dc.identifier.urihttps://repositorioslatinoamericanos.uchile.cl/handle/2250/5367393
dc.description.abstractThis paper reports a new method for observing the presence of self-heating effect through transistor efficiency (gm/ID) signature from DC measurements, for fast and accurate analysis. This new method is tested first through numerical simulations employing simple analytical models, and then applied experimentally. The transistor efficiencies of short and long channel pFinFETs were used for experimental observation of self-heating effects in this paper. It is possible to see if the self-heating is weak, moderate or strong through the signature format observed on gm/ID versus ID curve.
dc.languageeng
dc.publisherIeee
dc.relation2017 Ieee Soi-3d-subthreshold Microelectronics Technology Unified Conference (s3s)
dc.rightsAcesso aberto
dc.sourceWeb of Science
dc.subjectSelf-heating effect (SHE)
dc.subjectSOI
dc.subjectFinFET
dc.titleNew method for observing self-heating effect using transistor efficiency signature
dc.typeActas de congresos


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