A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

dc.creatorDias, Marcelino
dc.creatorCosta, Thiago Antônio
dc.creatorSilva, Bismarck Luiz
dc.creatorSpinelli, José Eduardo
dc.creatorCheunga, Noé
dc.creatorGarcia, Amauri
dc.date.accessioned2021-04-12T20:47:48Z
dc.date.accessioned2022-10-06T14:05:55Z
dc.date.available2021-04-12T20:47:48Z
dc.date.available2022-10-06T14:05:55Z
dc.date.created2021-04-12T20:47:48Z
dc.date.issued2018-02
dc.identifierDIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029
dc.identifier0026-2714
dc.identifierhttps://repositorio.ufrn.br/handle/123456789/32178
dc.identifier10.1016/j.microrel.2017.12.029
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3974881
dc.publisherElsevier
dc.rightshttp://creativecommons.org/licenses/by/3.0/br/
dc.rightsAttribution 3.0 Brazil
dc.subjectSolder alloys
dc.subjectSn-Sb alloys
dc.subjectMicrostructure
dc.subjectTensile properties
dc.subjectWettability
dc.titleA comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
dc.typearticle


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