Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys

dc.creatorMoreno, Gustavo R.
dc.creatorSilva, Bismarck Luiz
dc.creatorBogno, Abdoul-Aziz
dc.creatorHenein, Hani
dc.creatorSpinelli, Jose Eduardo
dc.date.accessioned2021-03-15T20:55:23Z
dc.date.accessioned2022-10-06T13:24:42Z
dc.date.available2021-03-15T20:55:23Z
dc.date.available2022-10-06T13:24:42Z
dc.date.created2021-03-15T20:55:23Z
dc.date.issued2016-09-25
dc.identifierMORENO, Gustavo R.; SILVA, Bismarck L.; BOGNO, Abdoul-Aziz; HENEIN, Hani; SPINELLI, José E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, [S.L.], v. 680, p. 259-267, set. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838816311070?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.jallcom.2016.04.129
dc.identifier0925-8388
dc.identifierhttps://repositorio.ufrn.br/handle/123456789/31886
dc.identifier10.1016/j.jallcom.2016.04.129
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3968278
dc.publisherElsevier
dc.rightshttp://creativecommons.org/licenses/by/3.0/br/
dc.rightsAttribution 3.0 Brazil
dc.subjectImpulse atomization
dc.subjectMicrostructure
dc.subjectSolders
dc.subjectHardness
dc.subjectWettability
dc.titleMicrostructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys
dc.typearticle


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