Material processing by plasma shock wave generated in an inverse Z-pinch plasma expander

dc.contributorUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-20T13:27:38Z
dc.date.accessioned2022-10-05T13:23:26Z
dc.date.available2014-05-20T13:27:38Z
dc.date.available2022-10-05T13:23:26Z
dc.date.created2014-05-20T13:27:38Z
dc.date.issued2003-01-01
dc.identifierPlasma Physics. Melville: Amer Inst Physics, v. 669, p. 339-342, 2003.
dc.identifier0094-243X
dc.identifierhttp://hdl.handle.net/11449/9150
dc.identifier10.1063/1.1593934
dc.identifierWOS:000184031800084
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3885570
dc.description.abstractThe applicability of plasma shock wave for material processing was investigated using modified inverse Z-pinch device. Shock wave expanding speed and plasma spectral analysis were studied using an internal magnetic,probe and spatially collimated light spectroscopy. The material processing capability of the device was shown by many different surface analysis techniques such as AES, IRS, EPM and SEM. The interactions between a plasma shock wave of similar to4x10(6) cm/s speed with a Si substrate surface shows some ion implantation capability using a nitrogen plasma and thin film formation using a methane plasma.
dc.languageeng
dc.publisherAmerican Institute of Physics (AIP)
dc.relationPlasma Physics
dc.rightsAcesso aberto
dc.sourceWeb of Science
dc.titleMaterial processing by plasma shock wave generated in an inverse Z-pinch plasma expander
dc.typeTrabalho apresentado em evento


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