dc.contributorInstituto Nacional de Pesquisas Espaciais (INPE)
dc.contributorUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-20T13:27:37Z
dc.date.accessioned2022-10-05T13:23:21Z
dc.date.available2014-05-20T13:27:37Z
dc.date.available2022-10-05T13:23:21Z
dc.date.created2014-05-20T13:27:37Z
dc.date.issued2002-07-01
dc.identifierPhysica Status Solidi B-basic Research. Weinheim: Wiley-v C H Verlag Gmbh, v. 232, n. 1, p. 116-120, 2002.
dc.identifier0370-1972
dc.identifierhttp://hdl.handle.net/11449/9137
dc.identifier10.1002/1521-3951(200207)232:1<116
dc.identifierWOS:000177304400023
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/3885560
dc.description.abstractThe results of nanohardness measurements at a film surface and film-substrate interface are presented and discussed. An electron beam device was used to deposit a Ti film on a 304 stainless steel (304 SS) substrate. The diluted interface was obtained by thermal activated atomic diffusion. The. Ti film and Ti film-304 SS interface were analyzed by energy dispersive spectrometry and were observed using atomic force microscopy. The nanohardness of the Ti film-304 SS system was measured by a nanoindentation technique. The results showed the Ti film-304 SS interface had a higher hardness value than the Ti film and 304 SS substrate. The Ti film surface had a lower hardness due to the presence of a TiO2 thin layer.
dc.languageeng
dc.publisherWiley-Blackwell
dc.relationPhysica Status Solidi B: Basic Research
dc.relation1.729
dc.relation0,602
dc.rightsAcesso restrito
dc.sourceWeb of Science
dc.titleNanohardness of a Ti thin film and its interface deposited by an electron beam on a 304 SS substrate
dc.typeArtigo


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