Actas de congresos
Effect of Wood Moisture Content in Edge Glued Panel Bonding for Furniture Industry: Analysis of Shear-Stress and Rupture in Bondline
Fecha
2014-01-01Registro en:
Advanced Materials Research, v. 1025-1026, p. 227-232.
1662-8985
1022-6680
10.4028/www.scientific.net/AMR.1025-1026.227
2-s2.0-84913545869
2-s2.0-84913545869.pdf
4442058033045499
1216644357418833
0000-0001-9669-6820
Autor
Duratex
Universidade Estadual Paulista (Unesp)
Universidade de São Paulo (USP)
Institución
Resumen
The objective of this article was to study the influence of the Pinus taeda wood moisture content to the production of EGP (Edge Glued Panel) in the bonding stage, using PVA adhesive. It was analyzed the joint resistances through shear-stress tests and rupture in the bondline. The wood moisture classes adopted to the panels were: “A” ([8%, 9% [), “B” ([9%, 10% [), “C” ([10%, 11% [), “D” ([11%, 12% [) e “E” ([12%, 13%[). After the panel production, it was sawn the specimens for the resistance shear in the bondline tests by traction. The tests results showed that it was statistically significant differences to the values of rupture tensions between A class and B, C, D and E classes. The wood medium rupture presented a tendency to reduce with the moisture increase, and the total rupture in the bondline presented a small tendency of a less number of occurrences with the rupture tension increases.