Otros
The second International Symposium on Fungal Stress: ISFUS
Fecha
2018-06-01Registro en:
Fungal Biology. Oxford: Elsevier Sci Ltd, v. 122, n. 6, p. 386-399, 2018.
1878-6146
10.1016/j.funbio.2017.10.011
WOS:000436200900002
WOS000436200900002.pdf
8817669953838863
Autor
Alders English Serv
Universidade Federal de Goiás (UFG)
Universidade Federal de São Carlos (UFSCar)
Chinese Acad Sci
Univ Fed Rio Grande do Sul
Univ Saskatchewan
Univ Helsinki
Universidade Federal do Rio de Janeiro (UFRJ)
Univ Dundee
Univ Gottingen
Universidade de São Paulo (USP)
Queens Univ Belfast
Utah State Univ
Geisel Sch Med Dartmouth
Univ Tuscia
Univ Seville
Universidade Estadual Paulista (Unesp)
AIT Austrian Inst Technol GmbH
CONICET Univ Nacl La Plata UNLP
Univ Autonoma Metropolitana Iztapalapa
Swedish Univ Agr Sci
Universidade Estadual de Maringá (UEM)
Institución
Resumen
The topic of 'fungal stress' is central to many important disciplines, including medical mycology, chronobiology, plant and insect pathology, industrial microbiology, material sciences, and astrobiology. The International Symposium on Fungal Stress (ISFUS) brought together researchers, who study fungal stress in a variety of fields. The second ISFUS was held in May 8-11 2017 in Goiania, Goias, Brazil and hosted by the Instituto de Patologia Tropical e Satide Pablica at the Universidade Federal de Goias. It was supported by grants from CAPES and FAPEG. Twenty-seven speakers from 15 countries presented their research related to fungal stress biology. The Symposium was divided into seven topics: 1. Fungal biology in extreme environments; 2. Stress mechanisms and responses in fungi: molecular biology, biochemistry, biophysics, and cellular biology; 3. Fungal photobiology in the context of stress; 4. Role of stress in fungal pathogenesis; 5. Fungal stress and bioremediation; 6. Fungal stress in agriculture and forestry; and 7. Fungal stress in industrial applications. This article provides an overview of the science presented and discussed at ISFUS-2017. (C) 2017 British Mycological Society. Published by Elsevier Ltd. All rights reserved.