dc.creatorPECEQUILO, Cristiane Vargas
dc.creatorPANOSSIAN, Zehbour
dc.date.accessioned2012-10-19T01:47:59Z
dc.date.accessioned2018-07-04T14:52:15Z
dc.date.available2012-10-19T01:47:59Z
dc.date.available2018-07-04T14:52:15Z
dc.date.created2012-10-19T01:47:59Z
dc.date.issued2010
dc.identifierELECTROCHIMICA ACTA, v.55, n.12, p.3870-3875, 2010
dc.identifier0013-4686
dc.identifierhttp://producao.usp.br/handle/BDPI/18799
dc.identifier10.1016/j.electacta.2010.01.113
dc.identifierhttp://dx.doi.org/10.1016/j.electacta.2010.01.113
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1615591
dc.description.abstractCopper strike baths are extensively used in metal plating industry as they present the ability to plate adherent copper layers on less-noble metal substrates such as steel and zinc die castings. However, in the last few years, due to environmental controls and safety policies for operators, the plating industry has been interested in replacing the toxic cyanide copper strike baths with environmentally friendly baths. A broad bibliographic review showed that the published papers, referring to the new nontoxic copper strike baths, are patents, having little or no emphasis focused on electrodeposition mechanisms. Therefore, it was decided to study the copper electrodeposition mechanism from a strike alkaline bath prepared with one of the most nontoxic chelating agents cited in many patents which is the 1-hydroxyethane-1,1-diphosphonic acid, known as HEDP. This acid forms very stable water soluble complexes with Cu(2+) ions, thus cupric sulfate was used for preparing the plating bath. The results obtained through a cyclic voltammetry technique showed that Cu(2+) ion reduction to Cu from an HEDP electrodeposition bath occurs via a direct reduction reaction without a formation of Cu(+) intermediates. (C) 2010 Elsevier Ltd. All rights reserved.
dc.languageeng
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD
dc.relationElectrochimica Acta
dc.rightsCopyright PERGAMON-ELSEVIER SCIENCE LTD
dc.rightsrestrictedAccess
dc.subjectCopper electrodeposition
dc.subjectCupric complexes
dc.subjectCyclic voltammetry
dc.subjectElectrodeposited films
dc.subjectMetal coatings
dc.titleStudy of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique
dc.typeArtículos de revistas


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