Interrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys

dc.creatorOsorio
dc.creatorWislei R.; Garcia
dc.creatorAmauri
dc.date2016
dc.date2017-11-13T13:16:05Z
dc.date2017-11-13T13:16:05Z
dc.date.accessioned2018-03-29T05:53:28Z
dc.date.available2018-03-29T05:53:28Z
dc.identifierScience And Technology Of Welding And Joining . Taylor & Francis Ltd, v. 21, p. 429 - 437, 2016.
dc.identifier1362-1718
dc.identifier1743-2936
dc.identifierWOS:000378526900001
dc.identifier10.1080/13621718.2015.1124176
dc.identifierhttp://www.tandfonline.com/doi/abs/10.1080/13621718.2015.1124176?journalCode=ystw20
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/327481
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1364506
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionA comparative investigation on the wettability and tensile strength of a Sn-2Ag, a Sn-40Bi and the traditional eutectic Sn-Pb solder alloys was carried out. The wettability is represented by thickness of covered layer (TCL) and spread area (SA) while the mechanical behaviour by the ultimate tensile strength (UTS). It is shown that the TCL of studied alloys decreased with the increase in the dipping temperature. It is also shown that TCL and SA have opposite behaviour with respect to the cooling rate. The Sn-Bi solder alloy has lower SA when compared with those of the Sn-Ag solder when similar cooling rates are considered. The Sn-Bi solder exhibits the best UTS/SA combination for dendritic spacings between 25 and 27 mu m, associated with cooling rates similar to 2 degrees C s(-1), 2x lower than those of the Sn-Ag alloy. Besides, the Sn-Bi alloy has shown SA > 70 similar to 80% associated with higher UTS (similar to 80 MPa) as compared with the other alloys examined.
dc.description21
dc.description6
dc.description429
dc.description437
dc.descriptionFAEPEX-UNICAMP
dc.descriptionCNPq (The Brazilian Research Council) [305502/2014-0, 446797/2014-6]
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.languageEnglish
dc.publisherTaylor & Francis Ltd
dc.publisherAbingdon
dc.relationScience and Technology of Welding and Joining
dc.rightsfechado
dc.sourceWOS
dc.subjectLead-free Solders
dc.subjectWettability
dc.subjectDipping
dc.subjectTensile Strength
dc.subjectMicrostructure
dc.subjectRelative Cost
dc.titleInterrelation Of Wettability-microstructure-tensile Strength Of Lead-free Sn-ag And Sn-bi Solder Alloys
dc.typeArtículos de revistas


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