Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy

dc.creatorSantos, WLR
dc.creatorBrito, C
dc.creatorQuaresma, JMV
dc.creatorSpinelli, JE
dc.creatorGarcia, A
dc.date2014
dc.dateMAR
dc.date2014-07-30T14:32:20Z
dc.date2015-11-26T16:47:47Z
dc.date2014-07-30T14:32:20Z
dc.date2015-11-26T16:47:47Z
dc.date.accessioned2018-03-28T23:34:01Z
dc.date.available2018-03-28T23:34:01Z
dc.identifierMaterials Science And Engineering B-advanced Functional Solid-state Materials. Elsevier Science Bv, v. 182, n. 29, n. 36, 2014.
dc.identifier0921-5107
dc.identifier1873-4944
dc.identifierWOS:000331926100005
dc.identifier10.1016/j.mseb.2013.11.016
dc.identifierhttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/59941
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/59941
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1274944
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionAlthough Zn-Sn alloys have suitable features for high temperature solders, as for example the absence of intermetallic compounds (IMCs) and relatively high melting temperatures, the control of the scale of the microstructure by adequate pre-programming of the solidification thermal parameters remains still a task to be accomplished. The present study focuses on the interrelation among hardness, microstructure features/segregation and solidification thermal parameters. An upward directional transient solidification apparatus was used in order to permit samples along a range of cooling rates to be obtained for such evaluation. The entire Zn-20wt%Sn alloy casting is characterized by a two-phase alternated structure, which resembles the morphology of a lamellar eutectic. Experimental growth laws having -1/2 and -1/4 exponents are proposed relating the interphase spacing to the growth rate and the cooling rate, respectively. The morphology and size of the Zn-rich plate-like cells, as well as the macrosegregation pattern are shown to affect the hardness. (C) 2013 Elsevier B.V. All rights reserved.
dc.description182
dc.description29
dc.description36
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFAPESP [2012/08494-0]
dc.languageen
dc.publisherElsevier Science Bv
dc.publisherAmsterdam
dc.publisherHolanda
dc.relationMaterials Science And Engineering B-advanced Functional Solid-state Materials
dc.relationMater. Sci. Eng. B-Adv. Funct. Solid-State Mater.
dc.rightsfechado
dc.rightshttp://www.elsevier.com/about/open-access/open-access-policies/article-posting-policy
dc.sourceWeb of Science
dc.subjectMicrostructure
dc.subjectPb free solder alloys
dc.subjectZn-Sn solder
dc.subjectSolidification
dc.subjectHardness
dc.subjectAl-fe Alloys
dc.subjectSn-ag
dc.subjectUnidirectional Solidification
dc.subjectIntermetallic Compounds
dc.subjectMechanical-properties
dc.subjectRapid Solidification
dc.subjectPeritectic Alloys
dc.subjectCu Alloys
dc.subjectMicrostructure
dc.subjectBehavior
dc.titlePlate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy
dc.typeArtículos de revistas


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