Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications

dc.creatorSpinelli, JE
dc.creatorSilva, BL
dc.creatorGarcia, A
dc.date2014
dc.dateJUN
dc.date2014-07-30T14:02:03Z
dc.date2015-11-26T16:39:30Z
dc.date2014-07-30T14:02:03Z
dc.date2015-11-26T16:39:30Z
dc.date.accessioned2018-03-28T23:23:07Z
dc.date.available2018-03-28T23:23:07Z
dc.identifierMaterials & Design. Elsevier Sci Ltd, v. 58, n. 482, n. 490, 2014.
dc.identifier0261-3069
dc.identifier1873-4197
dc.identifierWOS:000333423900060
dc.identifier10.1016/j.matdes.2014.02.026
dc.identifierhttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/56886
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/56886
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1272494
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionThe conversion to RoHS-compliant lead-free assembly has been a considerable challenge to the electronics industry. Among several alternative solder alloys, Bi-Ag alloys have been highlighted as a potential candidate to replace high Pb solder alloys for applications in oil and gas, automotive and avionics industries. The typical melting temperatures of Bi-Ag near-eutectic alloys are considered acceptable and excellent mechanical properties may be achieved with appropriate microstructures. Such promising alloys for high temperature soldering remain barely understood especially regarding non-equilibrium solidification features. In this study, a directional solidification experiment was carried out with the Bi-2.5 wt%Ag eutectic so that a large range of cooling rates (T) over dot could be obtained under unsteady-state conditions. The experimental investigation include: thermal solidification parameters (growth rate, v and cooling rate, (T) over dot), microstructure parameters (eutectic/dendritic spacing, interphase spacings) and phases morphologies analyzed by optical microscopy, scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and hardness. Experimental interrelations between hardness and microstructure (scale and morphology) of the eutectic Bi-Ag are reported. Solidification parameters are also associated with each configuration observed along the casting, i.e., coexistence of dendrites and eutectic cells for regions very close to the cooled casting surface, eutectic cells prevailing and eutectic cells together with beta-Bi primary phase. The cell spacing, lambda(c), is correlated with hardness by Hall-Petch type equations. (C) 2014 Elsevier Ltd. All rights reserved.
dc.description58
dc.description482
dc.description490
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFAPESP [2013/13030-5]
dc.languageen
dc.publisherElsevier Sci Ltd
dc.publisherOxford
dc.publisherInglaterra
dc.relationMaterials & Design
dc.relationMater. Des.
dc.rightsfechado
dc.rightshttp://www.elsevier.com/about/open-access/open-access-policies/article-posting-policy
dc.sourceWeb of Science
dc.subjectSolidification
dc.subjectMicrostructure
dc.subjectBi-Ag alloys
dc.subjectHardness
dc.subjectSolders
dc.subjectMechanical-properties
dc.subjectDirectional Solidification
dc.subjectSn-ag
dc.subjectZn
dc.subjectBehavior
dc.subjectCu
dc.subjectTransition
dc.subjectArray
dc.subjectAl
dc.titleMicrostructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications
dc.typeArtículos de revistas


Este ítem pertenece a la siguiente institución