The role of Cu-based intermetallics on the pitting corrosion behavior of Sn-Cu, Ti-Cu and Al-Cu alloys

dc.creatorOsorio, WR
dc.creatorFreire, CM
dc.creatorCaram, R
dc.creatorGarcia, A
dc.date2012
dc.dateAUG 30
dc.date2014-07-30T19:00:16Z
dc.date2015-11-26T16:29:57Z
dc.date2014-07-30T19:00:16Z
dc.date2015-11-26T16:29:57Z
dc.date.accessioned2018-03-28T23:11:00Z
dc.date.available2018-03-28T23:11:00Z
dc.identifierElectrochimica Acta. Pergamon-elsevier Science Ltd, v. 77, n. 189, n. 197, 2012.
dc.identifier0013-4686
dc.identifierWOS:000307131300028
dc.identifier10.1016/j.electacta.2012.05.106
dc.identifierhttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/72371
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/72371
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1269853
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionThe aim of this study is to evaluate the effect of three different intermetallics; Cu6Sn5, Ti2Cu and Al2Cu, on pitting corrosion of Sn-2.8 wt.% Cu, Ti-5 wt.% Cu and Al-5 wt.% Cu as-cast alloys, respectively. Chill-cast and centrifuged-cast samples were subjected to potentiodynamic polarization corrosion tests in a sodium chloride solution at 25 degrees C. It was found that the intermetallic particles play an important role in the process of pitting corrosion. The results have shown that the pitting potentials (E-Pit) of all three alloys experimentally examined have been displaced about 10 mV (SCE) toward the nobler-side potential when compared with the corresponding corrosion potentials (E-Corr.). It was also found that the lamellar morphology formed by alternated solvent-rich/intermetallics phases, which characterizes the microstructure of any alloy examined, provides an enveloping effect giving rise to a protective barrier against corrosion. Other microstructural features associated with the ratio of anode/cathode areas for each alloy examined are also discussed. (C) 2012 Elsevier Ltd. All rights reserved,
dc.description77
dc.description189
dc.description197
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFAEPEX-UNICAMP
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.descriptionConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.descriptionFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.languageen
dc.publisherPergamon-elsevier Science Ltd
dc.publisherOxford
dc.publisherInglaterra
dc.relationElectrochimica Acta
dc.relationElectrochim. Acta
dc.rightsfechado
dc.rightshttp://www.elsevier.com/about/open-access/open-access-policies/article-posting-policy
dc.sourceWeb of Science
dc.subjectIntermetallics
dc.subjectPitting corrosion
dc.subjectLamellar microstructure
dc.subjectSn-Cu, Ti-Cu, Al-Cu alloys
dc.subjectLead-free Solder
dc.subjectMechanical-properties
dc.subjectElectrochemical Characteristics
dc.subjectMicrostructure Array
dc.subjectLocalized Corrosion
dc.subjectAluminum-alloys
dc.subjectNacl Solution
dc.subjectPhases
dc.subjectResistance
dc.subjectTitanium
dc.titleThe role of Cu-based intermetallics on the pitting corrosion behavior of Sn-Cu, Ti-Cu and Al-Cu alloys
dc.typeArtículos de revistas


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