Low-resistance films of polyimides with impregnated copper sulfide

dc.creatorRowe, RVA
dc.creatorKunita, MH
dc.creatorPorto, MF
dc.creatorMuniz, EC
dc.creatorRubira, AF
dc.creatorNery, RC
dc.creatorRadovanovic, E
dc.creatorTaylor, LT
dc.creatorNazem, N
dc.date2001
dc.dateNOV
dc.date2014-11-16T20:10:22Z
dc.date2015-11-26T16:25:07Z
dc.date2014-11-16T20:10:22Z
dc.date2015-11-26T16:25:07Z
dc.date.accessioned2018-03-28T23:05:56Z
dc.date.available2018-03-28T23:05:56Z
dc.identifierJournal Of Materials Research. Materials Research Society, v. 16, n. 11, n. 3097, n. 3106, 2001.
dc.identifier0884-2914
dc.identifierWOS:000172020600014
dc.identifier10.1557/JMR.2001.0427
dc.identifierhttp://www.repositorio.unicamp.br/jspui/handle/REPOSIP/52841
dc.identifierhttp://www.repositorio.unicamp.br/handle/REPOSIP/52841
dc.identifierhttp://repositorio.unicamp.br/jspui/handle/REPOSIP/52841
dc.identifier.urihttp://repositorioslatinoamericanos.uchile.cl/handle/2250/1268563
dc.descriptionSurface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton (R) polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 degreesC for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton (R) composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.
dc.descriptiono TEXTO COMPLETO DESTE ARTIGO, ESTARÁ DISPONÍVEL À PARTIR DE AGOSTO DE 2015.
dc.description16
dc.description11
dc.description3097
dc.description3106
dc.languageen
dc.publisherMaterials Research Society
dc.publisherWarrendale
dc.publisherEUA
dc.relationJournal Of Materials Research
dc.relationJ. Mater. Res.
dc.rightsembargo
dc.sourceWeb of Science
dc.subjectSurface Modification
dc.subjectModel Compounds
dc.subjectSilver
dc.subjectEsca
dc.subjectCus
dc.titleLow-resistance films of polyimides with impregnated copper sulfide
dc.typeArtículos de revistas


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